HY484 Two-Part Epoxy AB Glue Electronic Component Sealant Potting Adhesive for Transformer and PCB Board Sealing
US$3.61-5.90
/kilograms
Price varies depending on material, logo, quantity and customization requirements.
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Comprehensive Specifications
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Category:
Circuit Board Moisture Resistant Sealant
Introduction
| Classification | Double Components Adhesives | Usage | embedding electronic components |
| Main Raw Material | Epoxy | EINECS No. | 500-033-5 |
| CAS No. | 38891-59-7 | MF | C15H16O2 C2H7O |
| Other Names | epoxy potting compound | Type | Two-components |
| Product name | Two-Component epoxy potting compound | Application | electronic components |
| Main Material | epoxy resin | Feature | self-leveling |
| Characteristic | cold curing | Advantage | aging resisitance,moisture resistance,insulation |
| Keywords | electronic adhesive | Full curing time (h) | 48 |
| hardness (S.D) | ≥80 | Certificate | ROHSREACH |
We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.
Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:
- Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
- Strict quality control covering material selection, processing, surface finishing, and final packaging;
- Variety of products and specifications to meet diverse project requirements and application scenarios;
- OEM & customization support based on drawings, samples, or specific technical requirements;
- Flexible packaging solutions to ensure safe handling and transportation of products;
- Continuous improvement in products and services to better support customers in different markets.
If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.
