High-Extension Low-Modulus Non-Toxic Electronic Adhesive for Potting Circuit Boards and Solar Light Caps
US$0.90-12.50
/pieces
Price varies depending on material, logo, quantity and customization requirements.
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Comprehensive Specifications
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Category:
Electronic Component Sealant
Introduction
| Classification | Volatile Solvent Adhesives | Usage | Electronic |
| Main Raw Material | Modified silane | EINECS No. | 226-171-3 |
| CAS No. | 75009-88-0 | MF | C15H36O6Si2 |
| Other Names | Low Modulus Silane Sealant | Type | One Component Adhesive |
| Certification | ROHS and REACH | Appearance | Gray paste |
| Curing time | 2.0~3.0(mm /24h) | Surface drying time | 20~50min |
| Tensile strength | ≥0.7Mpa | Elongation at break | ≥650% |
| Elastic recovery rate | ≥70% | Tensile modulus | ≤0.4MPa |
| Fixed elongation adhesive property | Undamaged | Temperature resistance range | -40~120℃ |
We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.
Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:
- Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
- Strict quality control covering material selection, processing, surface finishing, and final packaging;
- Variety of products and specifications to meet diverse project requirements and application scenarios;
- OEM & customization support based on drawings, samples, or specific technical requirements;
- Flexible packaging solutions to ensure safe handling and transportation of products;
- Continuous improvement in products and services to better support customers in different markets.
If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.
