Two-Part Thermally Conductive Potting Compound for Power Electronics Module Encapsulation
US$2-4
/kilograms
Price varies depending on material, logo, quantity and customization requirements.
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Flexible & Scalable Solutions
Customizable Product Options
Comprehensive Specifications
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Category:
Electronic Component Sealant
Introduction
| Classification | Double Components Adhesives | Usage | for miscellaneous electronic devices |
| Main Raw Material | Silicone | EINECS No. | 230-391-5 |
| CAS No. | 7085-85-0 | MF | C6H7NO2 |
| Other Names | potting sealant | Type | Two Component |
| Color | Black or gray ( can customized) | Product name | thermal conductive potting compound |
| Usage | For Led display, power module and miscellaneous electronic devices | Features | Low Viscosity, good leveling, seismic, good fire resistance |
| Hardness | 60 shore A | Mixing ratio | 1:1 |
| Appearance | Black fluid and White fluid | Flame rete (UL) | V0 |
| Thermal conductivity | 3.0w/m.k-3.3w/m.k |
We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.
Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:
- Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
- Strict quality control covering material selection, processing, surface finishing, and final packaging;
- Variety of products and specifications to meet diverse project requirements and application scenarios;
- OEM & customization support based on drawings, samples, or specific technical requirements;
- Flexible packaging solutions to ensure safe handling and transportation of products;
- Continuous improvement in products and services to better support customers in different markets.
If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.
